# KiCad Footprint 
# Originally from the KiCad Official Libraries
#   http://github.com/kicad/
# Edited by Jenner for Wickerlib
#   http://github.com/wickerbox/wickerlib
# This library file is provided under the GPLv3
#   https://www.gnu.org/licenses/gpl-3.0.html
# The footprint may not be correct! It is the end
# user's responsibility to verify the package.
# 
# Verified: No
# Finished: Yes

(module QFN-20-1EP-4x4MM_P0.5MM (layer F.Cu) (tedit 59947AA0)
  (descr "20-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "QFN 0.5")
  (attr smd)
  (fp_text reference REF** (at 0 0) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value QFN-20-1EP_4x4mm_Pitch0.5mm (at 0 3.33) (layer F.Fab) hide
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 2.6 -2.6) (end -1.5 -2.6) (layer F.Fab) (width 0.049784))
  (fp_line (start 2.6 2.6) (end 2.6 -2.6) (layer F.Fab) (width 0.049784))
  (fp_line (start -2.6 2.6) (end 2.6 2.6) (layer F.Fab) (width 0.049784))
  (fp_line (start -2.6 2.5) (end -2.6 2.6) (layer F.Fab) (width 0.049784))
  (fp_line (start -2.6 -1.5) (end -2.6 2.5) (layer F.Fab) (width 0.049784))
  (fp_circle (center -2.032 -2.032) (end -1.905 -2.032) (layer F.SilkS) (width 0.1524))
  (fp_text user %R (at 0 -3.3) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -2.6 -1.5) (end -1.5 -2.6) (layer F.Fab) (width 0.0508))
  (fp_line (start 2.15 -2.15) (end 2.15 -1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 2.15) (end -2.15 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 2.15) (end 2.15 1.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.15 2.15) (end -1.375 2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 2.15) (end 1.375 2.15) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.15 -2.15) (end 1.375 -2.15) (layer F.SilkS) (width 0.15))
  (fp_circle (center -2 -0.975) (end -1.873 -0.975) (layer F.Fab) (width 0.1524))
  (pad 1 smd rect (at -1.965 -1) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 2 smd rect (at -1.965 -0.5) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 3 smd rect (at -1.965 0) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 4 smd rect (at -1.965 0.5) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 5 smd rect (at -1.965 1) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 6 smd rect (at -1 1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 7 smd rect (at -0.5 1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 8 smd rect (at 0 1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 9 smd rect (at 0.5 1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 10 smd rect (at 1 1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 11 smd rect (at 1.965 1) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 12 smd rect (at 1.965 0.5) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 13 smd rect (at 1.965 0) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 14 smd rect (at 1.965 -0.5) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 15 smd rect (at 1.965 -1) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 16 smd rect (at 1 -1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 17 smd rect (at 0.5 -1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 18 smd rect (at 0 -1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 19 smd rect (at -0.5 -1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 20 smd rect (at -1 -1.965 90) (size 0.73 0.3) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0254))
  (pad 21 smd rect (at 0.625 0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0762) (solder_paste_margin_ratio -0.2))
  (pad 21 smd rect (at 0.625 -0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0762) (solder_paste_margin_ratio -0.2))
  (pad 21 smd rect (at -0.625 0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0762) (solder_paste_margin_ratio -0.2))
  (pad 21 smd rect (at -0.625 -0.625) (size 1.25 1.25) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin 0.0762) (solder_paste_margin_ratio -0.2))
  (model Housings_DFN_QFN.3dshapes/QFN-20-1EP_4x4mm_Pitch0.5mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)