# KiCad Footprint 
# Originally from the KiCad Official Libraries
#   http://github.com/kicad/
# Edited by Jenner for Wickerlib
#   http://github.com/wickerbox/wickerlib
# This library file is provided under the GPLv3
#   https://www.gnu.org/licenses/gpl-3.0.html
# The footprint may not be correct! It is the end
# user's responsibility to verify the package.
#
# Verified: Yes
# Finished: Yes

(module MSOP-10-1EP-3x3MM-P0.5MM (layer F.Cu) (tedit 599478E5)
  (descr "MSE Package; 10-Lead Plastic MSOP, Exposed Die Pad (see Linear Technology 05081664_I_MSE.pdf)")
  (tags "SSOP 0.5")
  (attr smd)
  (fp_text reference REF** (at 0 0.7) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value MSOP-10-1EP-3x3MM-P0.5MM (at 0 2.55) (layer F.Fab) hide
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_circle (center -2.25 -1.75) (end -2.175 -1.625) (layer F.SilkS) (width 0.254))
  (fp_line (start -2.8 -1) (end -1.875 -1.8) (layer F.Fab) (width 0.049784))
  (fp_text user %R (at 0 -2.8) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start 2.8 1.8) (end 2.8 -1.8) (layer F.Fab) (width 0.0508))
  (fp_line (start -2.8 1.8) (end 2.8 1.8) (layer F.Fab) (width 0.0508))
  (fp_line (start -2.8 -1) (end -2.8 1.8) (layer F.Fab) (width 0.0508))
  (fp_line (start 2.8 -1.8) (end -1.875 -1.8) (layer F.Fab) (width 0.0508))
  (fp_line (start -1.625 -1.625) (end -1.625 -1.3775) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.625 -1.625) (end 1.625 -1.3775) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.625 1.625) (end 1.625 1.3775) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 1.625) (end -1.625 1.3775) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 -1.625) (end 1.625 -1.625) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.625 1.625) (end 1.625 1.625) (layer F.SilkS) (width 0.15))
  (fp_circle (center -2.175 -1.020773) (end -2.1 -0.895773) (layer F.Fab) (width 0.254))
  (pad 1 smd rect (at -2.105 -1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -2.105 -0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -2.105 0) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -2.105 0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -2.105 1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 2.105 1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at 2.105 0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at 2.105 0) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 2.105 -0.5) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at 2.105 -1) (size 0.89 0.305) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 11 smd rect (at 0.42 -0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 11 smd rect (at -0.42 0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
  (pad 11 smd rect (at -0.42 -0.47) (size 0.84 0.94) (layers F.Cu F.Paste F.Mask)
    (solder_paste_margin_ratio -0.2))
)