(module TSSOP-20_4.4x6.5mm_Pitch0.65mm_Handsoldering (layer F.Cu) (tedit 56867ABB)
  (descr "20-Lead Plastic Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SSOP 0.65")
  (attr smd)
  (fp_text reference REF** (at 0 -4.3) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value TSSOP-20_4.4x6.5mm_Pitch0.65mm (at 0 4.3) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_circle (center -1.6383 -2.67208) (end -1.38684 -2.44348) (layer F.SilkS) (width 0.15))
  (fp_line (start -3.95 -3.55) (end -3.95 3.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.95 -3.55) (end 3.95 3.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.95 -3.55) (end 3.95 -3.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.95 3.55) (end 3.95 3.55) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.225 3.375) (end 2.225 3.375) (layer F.SilkS) (width 0.15))
  (fp_line (start -3.75 -3.375) (end 2.225 -3.375) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -3.22 -2.925) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -3.22 -2.275) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -3.22 -1.625) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -3.22 -0.975) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -3.22 -0.325) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -3.22 0.325) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -3.22 0.975) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at -3.22 1.625) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at -3.22 2.275) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at -3.22 2.925) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at 3.22 2.925) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at 3.22 2.275) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at 3.22 1.625) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at 3.22 0.975) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at 3.22 0.325) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 16 smd rect (at 3.22 -0.325) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 3.22 -0.975) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 3.22 -1.625) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at 3.22 -2.275) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at 3.22 -2.925) (size 2 0.4) (layers F.Cu F.Paste F.Mask))
  (model Housings_SSOP.3dshapes/TSSOP-20_4.4x6.5mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
