(module TSSOP-30_4.4x7.8mm_Pitch0.5mm_Handsoldering (layer F.Cu) (tedit 58D2D345)
  (descr "TSSOP30: plastic thin shrink small outline package; 24 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot355-1_po.pdf)")
  (tags "SSOP 0.5")
  (attr smd)
  (fp_text reference REF** (at 0 -4.95) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value TSSOP-30_4.4x7.8mm_Pitch0.5mm (at 0 4.95) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_circle (center -1.75 -3.35) (end -2 -3.35) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.2 3.9) (end -2.2 -3.9) (layer F.Fab) (width 0.15))
  (fp_line (start 2.2 3.9) (end -2.2 3.9) (layer F.Fab) (width 0.15))
  (fp_line (start 2.2 -3.9) (end 2.2 3.9) (layer F.Fab) (width 0.15))
  (fp_line (start -2.2 -3.9) (end 2.2 -3.9) (layer F.Fab) (width 0.15))
  (fp_line (start -3.65 -4.2) (end -3.65 4.2) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.65 -4.2) (end 3.65 4.2) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.65 -4.2) (end 3.65 -4.2) (layer F.CrtYd) (width 0.05))
  (fp_line (start -3.65 4.2) (end 3.65 4.2) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.325 -4.025) (end 2.325 -4) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.325 4.025) (end 2.325 4) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.325 4.025) (end -2.325 4) (layer F.SilkS) (width 0.15))
  (fp_line (start -3.4 -4.075) (end 2.325 -4.075) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.325 4.025) (end 2.325 4.025) (layer F.SilkS) (width 0.15))
  (pad 16 smd rect (at 3 3.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 17 smd rect (at 3 3) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 18 smd rect (at 3 2.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 19 smd rect (at 3 2) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 20 smd rect (at 3 1.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 21 smd rect (at 3 1) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 22 smd rect (at 3 0.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 23 smd rect (at 3 0) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 24 smd rect (at 3 -0.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 25 smd rect (at 3 -1) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 26 smd rect (at 3 -1.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 27 smd rect (at 3 -2) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 28 smd rect (at 3 -2.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 29 smd rect (at 3 -3) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 30 smd rect (at 3 -3.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd rect (at -3 -3.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -3 -3) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at -3 -2.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at -3 -2) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at -3 -1.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at -3 -1) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -3 -0.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at -3 0) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at -3 0.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 10 smd rect (at -3 1) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 11 smd rect (at -3 1.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 12 smd rect (at -3 2) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 13 smd rect (at -3 2.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 14 smd rect (at -3 3) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (pad 15 smd rect (at -3 3.5) (size 1.2 0.3) (layers F.Cu F.Paste F.Mask))
  (model Housings_SSOP.3dshapes/TSSOP-24_4.4x7.8mm_Pitch0.65mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
